Effect of Modified Nano Silica on the Conductivity and Morphology Characteristics of Oxalic Acid-Doped Polyaniline Composites
Oxalic acid-doped polyaniline (OA-PANI) was incorporated with nano silica and amino silane-modified nano silica. The polymerization of aniline to produce OA-PANI incorporating nano silica (OA-PANI-NS) and PANI incorporating 3-amino-propyltriethoxysilane modified nano silica (OA-PANI-NS-AS) were carr...
总结: | Oxalic acid-doped polyaniline (OA-PANI) was incorporated with nano silica and amino silane-modified nano silica. The polymerization of aniline to produce OA-PANI incorporating nano silica (OA-PANI-NS) and PANI incorporating 3-amino-propyltriethoxysilane modified nano silica (OA-PANI-NS-AS) were carried out in 0.1 M oxalic acid in the presence of ammonium persulphate as an oxidizing agent. Different amounts of nano silica and 3-amino-propyltriethoxysilane modified nano silica (13%, 15%, 20%, 30% and 50% w/w) were incorporated with OA-PANI to investigate its conductivity behavior using an impedance test. The successful formations of OA-PANI-NS and OA-PANI-NS-AS were confirmed by FTIR. The morphology of OA-PANI-NS and OA-PANI-NS-AS were studied using XRD and FESEM. Based on the results, the conductivity of OA-PANI-NS and OA-PANI-NS-AS increased linearly with the increased amount of nano silica and 3-amino-propyltriethoxysilane-modified nano silica w/w%, from 13 to 20% w/w. Further increased in the amount of both fillers caused a significant decreased in the conductivity of OA-PANI-NS and OA-PANI-NS-AS. The maximum electrical conductivity achieved for OA-PANI-NS and OA-PANI-NS-AS were 1.43 x 10-4 Scm-1 and 4.0 x10-6S cm-1, respectively. Lower conductivity of OA-PANI-NS-AS compared to OA-PANI-NS due to the presence of 3-amino-propyltriethoxysilane inhibited the ion movement in the OA-PANI matrix caused by the agglomeration phenomenon. © 2021 The Authors. Published by ESG (www.electrochemsci.org). This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/4.0/). |
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ISSN: | 14523981 |
DOI: | 10.20964/2021.02.27 |