2-s2.0-85216873779. (2025). A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism. Measurement: Journal of the International Measurement Confederation, 248, . https://doi.org/10.1016/j.measurement.2025.116871
Chicago Style (17th ed.) Citation2-s2.0-85216873779. "A Chip X-ray Image Bubble Defect Detection Model Combined with Dual-Former Attention Mechanism." Measurement: Journal of the International Measurement Confederation 248 (2025). https://doi.org/10.1016/j.measurement.2025.116871.
MLA引文2-s2.0-85216873779. "A Chip X-ray Image Bubble Defect Detection Model Combined with Dual-Former Attention Mechanism." Measurement: Journal of the International Measurement Confederation, vol. 248, 2025, https://doi.org/10.1016/j.measurement.2025.116871.