APA (7th ed.) Citation

2-s2.0-77349084832. (2010). Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder. Intermetallics, 18(4), . https://doi.org/10.1016/j.intermet.2009.11.016

Chicago Style (17th ed.) Citation

2-s2.0-77349084832. "Effect of Bi Addition on the Activation Energy for the Growth of Cu5Zn8 Intermetallic in the Sn-Zn Lead-free Solder." Intermetallics 18, no. 4 (2010). https://doi.org/10.1016/j.intermet.2009.11.016.

MLA (8th ed.) Citation

2-s2.0-77349084832. "Effect of Bi Addition on the Activation Energy for the Growth of Cu5Zn8 Intermetallic in the Sn-Zn Lead-free Solder." Intermetallics, vol. 18, no. 4, 2010, https://doi.org/10.1016/j.intermet.2009.11.016.