Sazali, B., Hassan, S., Yusof, H. B., Husaini, N., Aziz, Y., Yaakub, A. B. A., & Tuan, T. N. B. (2024). Optimization of Design Parameters using Taguchi Method for Thermal Stress Analysis in a 3D IC. 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024. https://doi.org/10.1109/ISCAIE61308.2024.10576559
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Sazali, Bin, Syamil Hassan, Hasliza Binti Yusof, Norliana Husaini, Yusnira Aziz, Anees Binti Abdul Yaakub, و Tuan Norjihan Binti Tuan. "Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC." 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 2024. https://doi.org/10.1109/ISCAIE61308.2024.10576559.
توثيق جمعية اللغة المعاصرة MLA (الطبعة الثامنة)Sazali, Bin, et al. "Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC." 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024, 2024, https://doi.org/10.1109/ISCAIE61308.2024.10576559.