APA引文

Sazali, B., Hassan, S., Yusof, H. B., Husaini, N., Aziz, Y., Yaakub, A. B. A., & Tuan, T. N. B. (2024). Optimization of Design Parameters using Taguchi Method for Thermal Stress Analysis in a 3D IC. 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024. https://doi.org/10.1109/ISCAIE61308.2024.10576559

Chicago Style (17th ed.) Citation

Sazali, Bin, Syamil Hassan, Hasliza Binti Yusof, Norliana Husaini, Yusnira Aziz, Anees Binti Abdul Yaakub, and Tuan Norjihan Binti Tuan. "Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC." 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 2024. https://doi.org/10.1109/ISCAIE61308.2024.10576559.

MLA引文

Sazali, Bin, et al. "Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC." 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024, 2024, https://doi.org/10.1109/ISCAIE61308.2024.10576559.