A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism

Bubble defects in chip packaging can have an impact on the stability and reliability of the chip. Existing defect detection methods exhibit limited performance in identifying small-sized bubble defects and are highly susceptible to low contrast and noise in chip X-ray images, leading to missed and f...

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Bibliographic Details
Published in:MEASUREMENT
Main Authors: Li, Ang; Hamzah, Raseeda; Rahim, Siti Khatijah Nor Abdu
Format: Article
Language:English
Published: ELSEVIER SCI LTD 2025
Subjects:
Online Access:https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001423166800001

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