A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism

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A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism

Bubble defects in chip packaging can have an impact on the stability and reliability of the chip. Existing defect detection methods exhibit limited performance in identifying small-sized bubble defects and are highly susceptible to low contrast and noise in chip X-ray images, leading to missed and f...

書誌詳細
出版年:	MEASUREMENT
主要な著者:	Li, Ang; Hamzah, Raseeda; Rahim, Siti Khatijah Nor Abdu
フォーマット:	論文
言語:	English
出版事項:	ELSEVIER SCI LTD 2025
主題:	Engineering; Instruments & Instrumentation
オンライン･アクセス:	https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001423166800001

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