A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism
Bubble defects in chip packaging can have an impact on the stability and reliability of the chip. Existing defect detection methods exhibit limited performance in identifying small-sized bubble defects and are highly susceptible to low contrast and noise in chip X-ray images, leading to missed and f...
| 发表在: | MEASUREMENT |
|---|---|
| Main Authors: | , , , |
| 格式: | 文件 |
| 语言: | English |
| 出版: |
ELSEVIER SCI LTD
2025
|
| 主题: | |
| 在线阅读: | https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001423166800001 |