Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC

Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC

Thermal stress and deformation analysis plays an important role in understanding the effects of heat on the performance and reliability of a 3D integrated circuit (IC) design. The demand for smaller and powerful electronic devices, 3D IC design gained prominence due to their superior integration cap...

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Bibliographic Details
Published in:14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024
Main Author: Sazali S.B.; Hassan H.B.; Yusof N.; Husaini Y.; Aziz A.B.A.; Yaakub T.N.B.T.
Format: Conference paper
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2024
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906552&doi=10.1109%2fISCAIE61308.2024.10576559&partnerID=40&md5=e221c7106a1ea7bc0fe80390efca0f2c

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906552&doi=10.1109%2fISCAIE61308.2024.10576559&partnerID=40&md5=e221c7106a1ea7bc0fe80390efca0f2c

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