A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism
Bubble defects in chip packaging can have an impact on the stability and reliability of the chip. Existing defect detection methods exhibit limited performance in identifying small-sized bubble defects and are highly susceptible to low contrast and noise in chip X-ray images, leading to missed and f...
| 出版年: | Measurement: Journal of the International Measurement Confederation |
|---|---|
| 第一著者: | |
| フォーマット: | 論文 |
| 言語: | English |
| 出版事項: |
Elsevier B.V.
2025
|
| オンライン･アクセス: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85216873779&doi=10.1016%2fj.measurement.2025.116871&partnerID=40&md5=6675c1b67553df6fe12fb993d0a8b966 |