Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder
The growth kinetics of Cu5Zn8 phase has been investigated under long-term thermal exposure conditions using single shear lap joints. The Cu5Zn8 phase was formed by reacting Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. A scanning electron microscope (SEM) was used to observe the morphology...
| الحاوية / القاعدة: | Intermetallics |
|---|---|
| المؤلف الرئيسي: | |
| التنسيق: | مقال |
| اللغة: | English |
| منشور في: |
2010
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| الوصول للمادة أونلاين: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-77349084832&doi=10.1016%2fj.intermet.2009.11.016&partnerID=40&md5=b5fe8deb577b498569ede8870e1eb411 |