Optimization of Design Parameters using Taguchi Method for Thermal Stress Analysis in a 3D IC
Thermal stress and deformation analysis plays an important role in understanding the effects of heat on the performance and reliability of a 3D integrated circuit (IC) design. The demand for smaller and powerful electronic devices, 3D IC design gained prominence due to their superior integration cap...
| الحاوية / القاعدة: | 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 |
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| المؤلفون الرئيسيون: | , , , , , , |
| التنسيق: | Proceedings Paper |
| اللغة: | English |
| منشور في: |
IEEE
2024
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| الموضوعات: | |
| الوصول للمادة أونلاين: | https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700088 |